High Purity Aluminum Nitride

Product Details

Aluminum nitride is a kind of advanced thermal conductivity material. It not only has the characteristics of ceramic insulation and low thermal expansion, but also has the thermal conductivity same as metallic copper and aluminium. Its thermal conductivity is 7 to 10 times that of alumina while its mechanical property are similar to alumina ceramics. The coefficient of thermal expansion is similar to silicon. It is mainly used to make the support and heat dissipation substrate of high power semiconductor integrated circuits. At the same time, it is wildly used  in 5G communications, transportation, power, consumer electronics and defense industry and other fields. Carbothermal reduction nitriding technology is used in the production of high purity aluminum nitride powder. With such technology, the produced high purity aluminum nitride powder can apply to generate high thermal conductivity aluminum nitride ceramic substrate and thermal conductive filler.


Character:                                   

Ø  high purity         

Ø  High sintering activity            

Ø  Low oxygen content 

Ø  Sharp size distribution


Specification:


Index


N-S-Ⅰ

N-S-Ⅱ

specific surface area

m2/g

2.4~2.8

3.2~3.5

Particle   size(D50)

μm

1.1~1.3

0.8~1.0

Purity

O

wt%

<0.8

<0.8

C

ppm

<300

<300

Ca

ppm

150~200

<10

Si

ppm

<20

<10

Fe

ppm

<8

<8


Application:


AIN Ceramic / phosphor / ALON transparent ceramic / Filler


20190724182654_3920_



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