Superfine ATH For Copper-clad Plate

Product Details


This product is produced by special technology with high purity, low Na2O content and conductivity, particularly suitable for manufacturing copper-clad plate and package material of electronic components, etc.


Characteristic:

High purity;

Appropriate PSD;

Low Na2O content and conductivity.


Application:

Copper-clad plate;

Package material of electronic components;

Coating material of electronic components.


SPECIFICATION

Brands

H-WF-1LS

H-WF-1LE

Chemical Component(%)



Moisture

≤0.3

≤0.3

SiO2

≤0.02

≤0.02

Fe2O3

≤0.01

≤0.01

Na2O

≤0.15

≤0.12

Na2O(S)

≤0.02

≤0.01

physical properties



D50(μm)

1.0-1.5

1.0-1.5

Whiteness(%)

≥97

≥97

Oil   absorption(ml/100g)

≤40

≤40

+325   Mesh,%

≤0.1

≤0.1

Conductivity,μs/cm

≤50

≤30

 

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                      DTG

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                SEM


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