Superfine ATH For Copper-clad Plate
Product Details
This product is produced by special technology with high purity, low Na2O content and conductivity, particularly suitable for manufacturing copper-clad plate and package material of electronic components, etc.
Characteristic:
High purity;
Appropriate PSD;
Low Na2O content and conductivity.
Application:
Copper-clad plate;
Package material of electronic components;
Coating material of electronic components.
SPECIFICATION
Brands | H-WF-1LS | H-WF-1LE |
Chemical Component（%） | ||
Moisture | ≤0.3 | ≤0.3 |
SiO2 | ≤0.02 | ≤0.02 |
Fe2O3 | ≤0.01 | ≤0.01 |
Na2O | ≤0.15 | ≤0.12 |
Na2O（S） | ≤0.02 | ≤0.01 |
physical properties | ||
D50（μm） | 1.0-1.5 | 1.0-1.5 |
Whiteness（%） | ≥97 | ≥97 |
Oil absorption（ml/100g） | ≤40 | ≤40 |
+325 Mesh，% | ≤0.1 | ≤0.1 |
Conductivity，μs/cm | ≤50 | ≤30 |
DTG
SEM
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